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Spectral Touch Module. Type Of Device: Expansion Board/Evaluative Board. The Basic Components: As72651, As72652, As72653 (Ams / Ams Osram Group). Interface: I²c / Uart (Selected By A Switch), Compatible With Qwiic (Days)., Element Of Coordination Of The Impedance Of The Radio Frequency Tract. Type Of Component: A Passive Coordinating Element Of The Nch Training. Purpose: Coordination Of The Impedance Between The Output/Entrance Of The Nf-Module And The Antenna Or Other Elements Of The Rf-Chain. (Days), Lighting Measurement Module. Type Of Component: Digital Light Sensor Based On Tsl2561. Type Of Case: Module With Holes For Soldering / Pin Connector. Type Of Installation: Through Holes (Tht) Or On A Pin Connector. Interface: Digital - I²c (With The Ability To Choose Address: Gnd, Vcc, Floating) (Days)., Capacitor. Component Type: Multilayer Ceramic Capacitor (Mlcc). Type Of Case: 0402 (1.0 × 0.5 Mm). Type Of Installation: Smd (Superficial). Nominal Capacity: 33 Pf. Admission: ± 1 %. Nominal Voltage: 50 V. Dielectric: C0g (Np0) (Days)., Multiprophic Sensor. Component Type: Digital Optical Sensor For Spectral Analysis. Type Of Case: Smd/Smt. Type Of Installation: Superficial. Interface: Digital - I²c. Power Voltage: 1.8 V. Consumption: 280 Μa (Typical) (Days)., Radio Frequency Coaxial Connector. Component Type: Coaxial Rf-Line (Female), Ssmc, Corner (Right-Angle), With Mounting On The Panel (Bulkhead), For Through Installation (Thd). Type Of Fastening: Panel, Through (This). Configuration: The Nest Connector (Jack), Angle 90 °, With Threaded Fixation (Days), Multiprophic Light Sensor. Component Type: Master Chip Of The As7265x Multi-Competitive System. Type Of Case: Lga-20. Type Of Installation: Surface (Smd/Smt). Category: Ambient Light Sensors. Podkategoria: Optical Detectors & Sensors. Type: Multi-Spectral Sensor. Corresponds To Rohs. Moistenous Component (Msl - Yes) (Days)., Radiation Sensor. Type Of Device: Click Board ™ Based On The Bg51 Sensor. Category: Ionizing Radiation Sensors. Sensor Type: Bg51. Interface: Gpio. Type Of Connection: Mikrobus ™. Support For: Mikrosdk. Weight: 23 G. Dimensions: 57.15 × 25.4 Mm (Days)., Energy -Dependent Memory. Component Type: Nor Flash Memory With Spi Interface. Memory Volume: 256 Mbps (32 Mb). Sector Structure: 4 Kb (Uniform Division Into Sectors). Interface: Spi/Qspi/Dspi/Sdr. Working (Days)., Expansion Of The Ultraviolet Sensor. Type Of Device: Expansion Board/Evaluative Board. The Main Chip: As7331 (Uv/Multispectral Sensor, Ams/Ams Osram). Interface: Qwiic (I²c, 3.3 To Logic) (Days)., Ceramic Capacitor. Component Type: Mlcc (Multilayer Ceramic Capacitor) - A Multilayer Ceramic Capacitor. Nominal Capacity: 10 Μf. Nominal Voltage: 16 In Dc. Admission: ± 10 %. Dielectric: X5r. Type Of Case: 0805 (2.0 × 1.25 Mm). Capacity: 10 Μf. Voltage: 16 V (Dc) (Days), Ceramic Capacitor. Component Type: Mlcc (Multilayer Ceramic Capacitor) - A Multilayer Ceramic Capacitor. Nominal Capacity: 100 Pf. Nominal Voltage: 16 In Dc. Admission: ± 10 %. Dielectric: X5r. Type Of Case: 0805 (2.0 × 1.25 Mm). Capacity: 10 Μf. Voltage: 16 V (Dc) (Days), Capacitor. Type: Mlcc - Multilayer Ceramic Capacitor (Multilayer Ceramic Capacitor). Nominal Capacity: 470 Nf (0.47 Μf). Corps: 0603 (1.6 × 0.8 Mm). Voltage: 25 In Dc. Temperature Coefficient: X7r. Admission: ± 10%. Type Of Installation: Surface (Smd) (Days)., Three -Axis Magnetometer. Type Of Component: The Digital Sensor Of The Magnetic Field. Type Of Case: Lga-16 (3 × 3 Mm). Type Of Installation: Smd (Superficial). Interface: Digital - I²c / Spi. Resolution: 18 Bits. Measurement Range: ± 0.8 Mt. (Days)., Ceramic Capacitor. Component Type: Mlcc (Multilayer Ceramic Capacitor) - A Multilayer Ceramic Capacitor. Nominal Capacity: 1 Matthew. Nominal Voltage: 16 In Dc. Admission: ± 10 %. Dielectric: X5r. Type Of Case: 0805 (2.0 × 1.25 Mm). Capacity: 10 Μf. Voltage: 16 V (Dc) (Days), The Voltage Sensor. Type Of Component: A Single -Channel Charge/Discharge Sensor Of The Battery. Corps: Msop. Type Of Installation: Smd/Smt. Category: Battle Management / Gas Gauge. Rohs: Corresponds (Days)., Connector. Type: Usb Type-C Connector, Through Installation (Th). Article On Lcsc: C165948. Type Of Interface: Usb Type-C (Plug/Outlet). Number Of Contacts: 24. Method Of Installation: Through Installation (Through Hole - Th) (Days), Inductive Coil. Work Frequency Range: From 500 Khz To 2 Mhz. Inductivity: 100 Μh ± 2 % At 2 Mhz. Strength (Q): At Least 30. Decret Toce (Dcr) Resistance: No More Than 6.0 Ohms. Typical Resonance Frequency (Srf): 34 Mhz. (Days)., Capacitor. Component Type: Multilayer Ceramic Capacitor (Mlcc). Type Of Case: 0402 (1.0 × 0.5 Mm). Type Of Installation: Smd (Superficial). Nominal Capacity: 10 Nf. Admission: ± 10 %. Nominal Voltage: 50 V. Dielectric: C0g (Np0) (Days)., Multiprophic Sensor. Type Of Component: Color Light Sensor (Secondary Chip Of The As7265x System). Corps: 20-Bflga. Type Of Installation: Surface (Smd). Weight: 6.036 Category: Multi Spectral Sensor. Serial Affiliation: As7265x. Status: Active. Corresponds To Rohs. Moistenous Component (Msl - Yes) (Days).
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