| Project Detail |
The objective of the Technology for European iNdependence in Space Image Sensors (TENSIS) project is to develop, manufacture, and validate a scalable, large-area, high-resolution, radiation tolerant, customizable, and affordable, 180nm CMOS detector, with the key technical characteristics of a 24K x 16K format matrix of 400MPixels. The targeted pixel pitch is 3.5µm to keep the overall matrix manufacturable with the proposed X-Fab 0.18µm CMOS Image Sensor process, and with high Full Well Capacity. Overall pixel electro-optical performances including MTF and spectral features will be enhanced by the design and implementation of specific optical stack in Back Side Illumination configuration, combining RGB&NIR filters with flat microlenses. As a by product of the design of the 24K x 16K detector, a 4K x 4K detector will also be designed and manufactured by Te2v in FSI then BSI configuration. Te2v will package produced dies in PCB package and deliver them to Airbus Defence and Space in Toulouse for detailed functional electro-optical characterization. Before this characterization test campaign, Airbus will develop dedicated test means including proximity boards both matching with the 24K x 16K and the 4K x 4K detectors, in close cooperation with Tev. A group of 4K x 4K BSI detectors initially electro-optically characterized by Airbus will then be delivered to ALTER, at Séville to be submitted to dedicated environmental tests, including TID, TNID and heavy ions radiation campaigns as well as burn-in and power on/off cycling tests. Thanks to this test campaign, the 4K x 4K detector die will reach TRL7 by the end of the project . The project will further aim at creating a strategic competitive advantage for the European partners, prime and equipment manufacturers and reduce the dependence on critical technologies and capabilities from outside EU. It will rely on the X-Fab foundry, which is key for the TENSIS project. |
