| Project Detail |
Two dimensional materials (2DM) and their van der Waals (vdW) heterostructures have opened new opportunities to develop atomically thin electronic and optoelectronic devices with a wide range of functionalities. While thousands of research papers demonstrate proof-of-concept studies with improved and novel performance using small-scale exfoliated crystals, a number of challenges still remains when these are attempted to be scaled up on wafer-scale with CVD grown 2DM. One of the key challenges is the transfer process of 2DM from their growth substrate to another 2DM or a target substrate for intended use. Currently, this process is performed using organic polymers to support 2DM, which introduces considerable amount of contamination and mechanical damage to the transferred layers. We propose to circumvent the existing issues of the transfer process by employing a new technique recently invented in NGI, which completely avoids use of organic compounds. This approach enables production of heterostructures with perfect interfaces free from interlayer contamination and correspondingly excellent (opto)electronic behaviour. In addition, eliminating polymeric supports allows new possibilities for vdW heterostructure fabrication: assembly at temperatures up to 600°C, and in different environments including ultra-high vacuum (UHV), liquid submersion and improved mechanical stability. This project will apply our novel approach for wafer-scale use, considering requirements of industrial companies, such as the choice of 2DMs and wafers, quality standards, throughput and reliability. The improved inorganic transfer technology will be then licensed to a selected 2DM foundry. In addition, we will develop an instrument for wafer-scale 2DM transfer that employs our innovative approach, which will be made available via spin-out company. Successful completion of the project can bring life to a wide range of industrial exploitation of 2DM in industrial nanotechnology applications. |
