| Project Detail |
The University of Illinois at Urbana-Champaign will develop an innovative cooling paradigm capable of both minimal energy use and maximum cooling power for future servers. Their design integrates high-performance thermal interface materials, coefficient of thermal expansion matched and reliable silicon carbide coolers, topology optimization-based design automation coupled with silicon carbide additive manufacturing, robust and cost-effective single-phase water cooling, and high primary-side temperatures to enable efficient heat dissipation to the ambient. |
