| Project Detail |
Paving the way for scalable biotemplated electronics
The discovery of various nanomaterials has revolutionised information processing technology, enabling the creation of more powerful computers. Carbon nanotubes (CNTs) are particularly promising due to their excellent properties as channel material in transistors. Computers based on CNT field-effect transistors (FETs) are theoretically predicted to provide a power-performance improvement of 10 times over those based on traditional silicon-based CMOS technology. Biofabrication techniques, such as DNA-templated CNT arrays, have made it possible to further scale the alignment of CNTs within FETs, improving their performance even further. The EU-funded 3D-BRICKS project will move towards conceiving three-dimensional CNT FETs and CNT nonvolatile memories. This breakthrough technology will enable the production of scalable biotemplated electronics that can be extended to multiple applications.
Silicon-based CMOS technology is approaching its performance limits, but the demand for more powerful computers — driven by rapid advances in applications such as the Internet of Things, big data and artificial intelligence (AI) — remains. The discovery of various nanomaterials provides new opportunities to further develop information processing technology. Carbon nanotubes (CNTs) have, in particular, demonstrated excellent properties as a channel material in transistors. Computers based on CNT field-effect transistors (FETs) have been theoretically predicted to provide a power-performance improvement of ten times over computers based on Si-CMOS technology. However, the fabrication of high-performance CNT-nanoelectronics, and the realization of the full potential of CNTs, is highly challenging. A technological revolution would be a reliable approach to fabricate a new family of CNT-based devices that could enable aligned arrangement of the nanotubes avoiding the critical steps related to nanolithography. In particular, biofabrication using DNA-templated CNT arrays FETs has been demonstrated to further scale the alignment of CNTs within the FETs well beyond standard lithographic feasibility. 3D-BRICKS will raise this concept of integrated self-assembly CNT-nanocircuits to a completely new level by moving towards the third dimension. Indeed, the versatility of DNA nanotechnology will be the root for conceiving 3-dimensional (3D) CNT-FETs and CNT-nonvolatile memories. DNA nanotechnology will also enable to complement the CNT deposition with metallic connections, hence realizing a working circuit. This will reduce the foot-print of the final device while enhancing its efficiency, hence providing a breakthrough solution to realize the next-generation nanoelectronics. Our approach will enable the production of scalable biotemplated electronics that can be extended to multiple applications such as metamaterials, sensors, optoelectronics, and others. |
