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United States Project Notice - Breaking The Board: Bringing 3 Dimensional Packaging And Thermal Management To Power Electronics


Project Notice

PNR 52869
Project Name Breaking the Board: Bringing 3 Dimensional Packaging and Thermal Management to Power Electronics
Project Detail Power electronics are a critical component in moving energy from sources like solar farms to the grid or batteries to electric motors. The traditional ceramic insulating layer in a power electronics module separates high-voltage circuitry from thermal management layers. These design restrictions lead to limitations in thermal management performance coupled with limits to power density, performance, and lifetime of power electronic devices. Project Innovation + Advantages: Synteris will use additive manufacturing to print transformative 3D ceramic packaging for power electronic modules. Existing power modules contain flat ceramic substrates that serve as the electrically insulating component and thermal conductor that transfer the large heat outputs of these devices. Synteris will replace the traditional insulating metalized substrate, substrate attach, and baseplate/heat exchanger with a ceramic component that acts an electrical insulator and heat exchanger for a dielectric fluid. This innovation in the design, manufacturability, and function of a power module will enable its better performance, lifetime, and form factor in electric vehicles, aircraft, renewable energy generation, electrical grid regulation, and other applications.
Funded By Self-Funded
Sector Energy & Power
Country United States , Northern America
Project Value USD 2,733,031

Contact Information

Company Name Synteris
Web Site https://arpa-e.energy.gov/technologies/projects/breaking-board-bringing-3-dimensional-packaging-and-thermal-management-power

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