| Project Detail |
A low-cost, efficient, integrated-circuit packaging solution for space applications
Space markets have entered a new age, thanks to contemporary business models as well as the increased use of integrated electronics aboard satellites. These tiny systems allow for drastic reductions of the satellite mass, thus enabling larger payloads and higher service revenues. Despite the fact that the space industry has moved from microscale electronics down to the submicron scale, efficient and competitive integrated-circuit packaging hinders downsizing efforts. The aim of the EU-funded COMAP-4S project is to design a ‘macro-component’ demonstration model for space applications, offering unmatched figures of merit for packaging. Leveraging advanced technologies, it will drastically reduce interconnection density, integration density and die surface. Moreover, compared to alternative packaging solutions, it will reduce packaging costs by three times. |
