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Tender For Semiconductor Wafer I.E. Gan/Algan Hemt Structure On 4-Inch Diameter Sic in India

Tender Notice

TenderID 92664960
Tender Brief Tender For Semiconductor Wafer I.E. Gan/Algan Hemt Structure On 4-Inch Diameter Sic
Competition Type ICB/NCB (Plz Refer Document)
Funded By Self-Funded
Country India
Tender Value INR 1,200,000
Tender Value In USD 14,543

Key Dates

Publish Date 13 Feb 2025
Last Date of Bid Submission 12 Mar 2025

CPVs

31000000-Electrical machinery, apparatus, equipment and consumables; lighting
31600000-Electrical equipment and apparatus
31680000-Electrical supplies and accessories

Other Detail

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