Tender Notice |
|
TenderID | 92664960 |
Tender Brief | Tender For Semiconductor Wafer I.E. Gan/Algan Hemt Structure On 4-Inch Diameter Sic |
Competition Type | ICB/NCB (Plz Refer Document) |
Funded By | Self-Funded |
Country | India |
Tender Value | INR 1,200,000 |
Tender Value In USD | 14,543 |
Key Dates |
|
Publish Date | 13 Feb 2025 |
Last Date of Bid Submission | 12 Mar 2025 |
CPVs |
|
31000000-Electrical machinery, apparatus, equipment and consumables; lighting | |
31600000-Electrical equipment and apparatus | |
31680000-Electrical supplies and accessories |
Other Detail |
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View Original Tender Notice / Tender Document |