Tender For Foundry Services For Mmic Fabrication INTEGRATE D CIRCUITS Preliminary Design Review for each wafer 2.00 Nos. - 2 INTEGRATE D CIRCUITS Mask set Fabrication 2.00 Nos. - 3 INTEGRATE D CIRCUITS Wafer Fabrication & processing 2.00 Nos. - 4 INTEGRATE D CIRCUITS On Wafer DC and RF Tests for circuits mentioned in Exhibit-D for maximum Eight Type of circuits per wafer 2.00 Nos. - 5 INTEGRATE D CIRCUITS Critical Design Review for each wafer 2.00 Nos. - 6 INTEGRATE D CIRCUITS Four Types of Probe Card 4.00 Nos. - Tender No : SAC/CPUR/SA202400054701 Page 25 of 26 7 INTEGRATE D CIRCUITS Other Cost (100% visual inspection, SEM, Dicing and Picking, packaging with identification and placing of Know Good dies and Bad dies in separate gel pack box, delivery etc.) Details of other cost is required 2.00 Nos. - Tender
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