Tender Notice |
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| TenderID | 91466607 |
| Tender Brief | Tenders Are Invited For The 2024 Chemical Palladium Plating For Unicompound Semiconductor Corporation(2) |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | China |
| Tender Value | Plz Refer Document |
| Tender Value In USD | Plz Refer Document |
Key Dates |
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| Publish Date | 20 Jan 2025 |
| Last Date of Bid Submission | 14 Feb 2025 |
Other Detail |
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| View Original Tender Notice / Tender Document |
