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Tenders Are Invited For Electronic Equipment Procurement Project(2) in China

Tender Notice
TenderID	90759570
Tender Brief	Tenders Are Invited For Electronic Equipment Procurement Project(2)
Competition Type	ICB/NCB (Plz Refer Document)
Funded By	Self-Funded
Country	China
Tender Value	Plz Refer Document
Tender Value In USD	Plz Refer Document

Key Dates
Publish Date	02 Jan 2025
Last Date of Bid Submission	23 Jan 2025

CPVs
	71000000-Architectural, construction, engineering and inspection services
	71600000-Technical testing, analysis and consultancy services
	71630000-Technical inspection and testing services

Other Detail
View Original Tender Notice / Tender Document

Work Detail
3D shape measurement equipment, 12-inch wafer fully automatic glue coating machine, Microwave plasma glue removal machine, PR glue applicator, Ultra-high resolution field emission scanning electron microscope & energy spectrometer, Wafer reflow equipment, 12-inch wafer fully automatic cleaning machine, 8/12-inch fully automatic wafer wet glue removal machine, 12-inch wafer fully automatic developing machine, 8/12-inch fully automatic wafer wet metal etching machine, Automatic optical inspection equipment

Contact Information
Contact Person	More details in the Chinese version of the tenderi
Address	More details in the Chinese version of the tendering document

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