Tender Notice |
|
| TenderID | 88504890 |
| Tender Brief | Tenders Are Invited For Wafer Surface Polishing Machine (Wafer Grinding Machine) (Emergency Notice) |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | Korea South |
| Tender Value | KRW 191,754,000 |
| Tender Value In USD | 147,651 |
Key Dates |
|
| Publish Date | 13 Nov 2024 |
| Last Date of Bid Submission | 27 Nov 2024 |
CPVs |
|
| 42000000-Industrial machinery | |
| 42600000-Machine tools | |
Other Detail |
|
| View Original Tender Notice / Tender Document |
