Project Name: Zhengzhou Xinghang Technology Co., Ltd. 8/12 Inch Wafer Silver Paste Bonder Purchase Project. Tenders Are Invited For Zhengzhou Xinghang Technology Co., Ltd. Purchased 14 8/12 Inch Wafer Silver Paste Bonder,The Device Is Used For Automatic Film Expansion, Dispensing, Die Bonding, Testing Of Wafers 12 Inches In Diameter Or Less In Integrated Circuit Packages. Its Worktables Are Suitable For Sop, Lqfp, Dfn, Qfn, Bga, Uniform Step And Multi-Step Matrix Lead Frames And Substrate Bonding. Products List: 1: 8/12 Inch Wafer Silver Paste Bonder Place Of Implementation: Henan Province Beginning Of Selling Bidding Documents: 2023-05-10 Ending Of Selling Bidding Documents: 2023-05-17 Price Of Bidding Documents: 1000/$150 Deadline For Submitting Bids/Time Of Bid Opening (Beijing Time): 2023-05-31 14:00 Tender Link : Https://Www.Chinabidding.Com/En/Detail/255187689-Bidnoticeen.Html
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No.1 Shuyuan East Road, Lintong District, Xi an, Attn: Ms. Du, Tel: +86-29-83896364
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