Tender Notice |
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| TenderID | 58450071 |
| Tender Brief | Tenders Are Invited For Semiconductor Wafer Bonding System |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | United States |
| Tender Value | Plz Refer Document |
| Tender Value In USD | Plz Refer Document |
Key Dates |
|
| Publish Date | 10 Dec 2022 |
| Last Date of Bid Submission | 01 Jan 2023 |
CPVs |
Other Detail |
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| View Original Tender Notice / Tender Document |
