Tender Notice |
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| TenderID | 118076096 |
| Tender Brief | Tenders Are Invited For University Of Science And Technology Beijing 8-Inch 2D Semiconductor Wafer Manufacturing And Integrated Innovation Support Center Platform Renovation Project (Supervision) |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | China |
| Tender Value | Plz Refer Document |
| Tender Value In USD | Plz Refer Document |
Key Dates |
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| Publish Date | 12 Sep 2026 |
| Last Date of Bid Submission | 08 Oct 2026 |
CPVs |
Other Detail |
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| View Original Tender Notice / Tender Document |
