Laboratory, Optical And Precision Equipments (Excl. Glasses) – Etching System For Deep Silicon Etching For Mems. The Ruhr University Bochum Intends To Procure A Drie Etching System That Will Be Used In The Bochum Microelectronics Research Laboratory For Wafer Substrates Up To 200 Mm In Diameter. It Will Be Used In The Field Of Silicon-Based Micro-Electro-Mechanical Systems (Mems) For Deep Anisotropic Silicon Etching Based On A Cyclic Etching Process (Drie, Bosch Process) And Will Also Serve To Research New Etching Concepts That Use Less Climate-Damaging Etching Gases.
Contact Information
Address
Universitätsstraße 150
Contact No.
+49 23432-0
Email
beschaffung@rub.de
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