Tenders are invited for DIGITAL PROCESSING UNIT FOR RF PAYLOADS AND MICROWAVE INSTRUMENTS- EXPRO+ Tender Action Number: 1-13044 Activity Number: 1000044321 Clarification Request Deadline 16/09/2026 13:00 CET Closing Date Extension Request Deadline 16/09/2026 13:00 CET Announcement Date 25/09/2025 Last Update On 28/07/2026 16:40 CET Update Reason Tender Action Issued Objectives: The objective of this activity is to design and develop a digital processing unit for RF payloads and microwave instruments using novel European technologies and components and to evaluate their performance.Description: Novel high-speed data acquisition and conversion devices together with reconfigurabledigital processing devices and high-speed digital data transmission are enabling a new generation of flexible, scalable and compact digital processing units for RF payloads.These units can perform direct conversion and reconfigurable digital processing for data reduction, allowing a simpler RF chain and reusing the same hardware to address different needs, from single channel reception and/or transmission to multiple channel reception and transmission, and in different domains, such as Earth Observation, Navigation, etc.Novel technologies exist, ranging from direct conversion to/from Ka-band, microprocessors, reconfigurable FPGAs with high-speed serial links, etc. in either fullyEuropean EEE components or EEEs with a significant European contribution such as building blocks and/or IP cores. These have promising performances and key parameters compatible with advanced digital processing units, but a comprehensive evaluation of these technologies working together as part of a system is still missing.Therefore, the proposed activity aims to take a systemic approach to the evaluation of such building blocks and technologies through breadboarding of a digital processing unit for RF payloads and microwave instruments. Reference operative scenarios relevant toRF payloads and microwave instruments shall be specified as use-cases and implemented, getting insight into technology gaps and limitations. The use cases focus on generic applications (i.e. EO, NAV).The following tasks are foreseen in the frame ofthis activity: Define at least two RF payload and/or microwave instrument use-cases, derive requirements for breadboarding and processing and assess EEE components with a significant European contribution to be used as building blocks of digital processing unitfor RF payloads (data acquisition and conversion, digital data processing, clock generation and distribution, high-speed links), including supporting SW toolchains. Breadboard representative digital processing unit using the identified technologies, such as analogue-to-digital (ADC), digital-to-analogue (DACs)converters, digital processing, and evaluate the selected technologies. DevelopSoftware and/or VHDL (Very High-Speed Integrated Circuit HardwareDescription Language) for implementing at least one of the defined use-cases.Read more Directorate Directorate of Tech, Eng. Quality Estabilishment ESTEC Open Date 28/07/2026 16:40 CET Closing Date 23/09/2026 13:00 CET ECOS Required Yes Classified No Price Range > 500 KEURO Authorised Contact Person Kieran Killard Initiating Service TEC-EFP IP Measure N/A Prog. Reference E/0904-611 - GSTP Element 1 Dev Tender Type Open Competition Open To Tenderers From DK Technology Keywords 1-A-I-System Technologies for Payload Data Processing 6-C-III-Near-Earth Transponders 6-D-II-Telecommunication Payloads 6-D-III-Remote Sensing Instruments 6-D-IV-Navigation Payloads Products Keywords 2-I-all.1-Instruments BB 2-L-2/3/4.1-m-Digital: Switching BB Tender Link : https://esastar-publication-ext.sso.esa.int/ESATenderActions/filter/open
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