Tender Notice |
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| TenderID | 116040447 |
| Tender Brief | Tenders Are Invited For New Semiconductor Wafer, Device Manufacturing, Circuit Board Design And Performance Testing Service Procurement Project Of Lanzhou University School Of Information Science And Engineering |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | China |
| Tender Value | Plz Refer Document |
| Tender Value In USD | Plz Refer Document |
Key Dates |
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| Publish Date | 23 Jul 2026 |
| Last Date of Bid Submission | 14 Aug 2026 |
CPVs |
Other Detail |
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| View Original Tender Notice / Tender Document |
