The Aim Of This Procurement Procedure Is To Award The Contract To The Best Bidder Identified During The Procurement Procedure For The Supply, Installation, Commissioning And Associated Services (Including Documentation And Trainings) Of An Automated Magnetic Wafer Probing System Capable Of Performing Wafer-Level Electrical Characterization Of Magnetic Devices Under Controlled Magnetic Fields On Semiconductor Wafers Up To 200 Mm And Optionally 300 Mm In Diameter At Silicon Austria Labs Gmbh.
Contact Information
Contact No.
+4314097609
Email
kanzlei@schramm-oehler.at
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