Tender Notice |
|
| TenderID | 111729900 |
| Tender Brief | Tenders Are Invited For 12-Inch Silicon Wafer Edge Polishing Machine For The Second Phase Of Shandong Youyan Rs 12-Inch Integrated Circuit Silicon Wafer Industrialization Project(2) |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | China |
| Tender Value | Plz Refer Document |
| Tender Value In USD | Plz Refer Document |
Key Dates |
|
| Publish Date | 13 Apr 2026 |
| Last Date of Bid Submission | 11 May 2026 |
Other Detail |
|
| View Original Tender Notice / Tender Document |
