Tenders Are Invited For Development And Space Qualification Of European 1550 Nm Distributed-Feedback Laser D ... in Netherlands The

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Tenders are invited for Development and Space Qualification of European 1550 Nm Distributed-Feedback Laser Diode Price Range > 500 KEURO To develop up to space qualification a European 1550 nm DFB Laser Diode module in a butterfly package.Description: Distributed-FeedBack (DFB) Laser diode modules at 1550 nm are a key enabling technology in a wide range of applications in space missions: Low-Earth-Orbit (LEO) downlinks, inter-satellite relays, optical communication terminals, and RF-Photonic telecom payloads. This optical source is ideal forvarious emerging functions such as LIDAR, optical sensing, optical switching, and coherent optical communication.The establishment of a space-qualified European supplier for a DFB Laser diode module at 1550 nm is essential in the context of future European spaceprograms, where no full European solution is available at this targeted wavelength.To contribute to the EEE component European Sovereignty initiative, critical elements of the module, in particular the DFB laser diode chip and packagingelements, shall be developed.The 1550nm DFB laser diode module will have the following characteristics:single frequency, highpower, narrow linewidth, low relative intensity noise, and high reliability in a butterfly package.The activity is divided into twophases. During the first phase, a new design in line with the market needs will be developed and characterized. The ESCC evaluationfirst for the Chip-on-Submount and then for the laser module will be carried out to assess the physical limit of the devices to define the parameters for ESCC qualification, the safe operating area, and the failuremodes/mechanisms.The second phase will start with the industrialization of the production and will conclude with the ESCC qualification tests to demonstrate product compliance with customers needs and space application constraints. It is expected that the product will be presented for introduction in the EuropeanPreferred Part List (EPPL) and to the European Qualified Part List (QPL).The activity encompasses the following tasks:Phase 1: Development, Pre-Industrialisation and Evaluation- Consolidation of the module technical requirements based on space usersneeds.- Design / delta-design activities for chip, chip on submount and module.- Characterization of performances on prototypes and delta-design activities- Preparation of ESCC evaluation (Process Identification document, Evaluation Test plan, production documentation) - Manufacturing of evaluation test batch- ESCC evaluation testing- Finalization of ESCC specifications and production documentationPhase 2: Industrialization and Qualification- Finalization of manufacturing process including subcontractors and suppliers-Production of the qualification batch- ESCC Qualification TestingDeliverables: Hardware (sample of evaluation and qualification),Report, (test results andESCC specifications)This activity is currently in the GSTP Work Plan but will only be implemented after confirmation of financial support from Delegations. The final list of participating states will be known at tender Tender Link : https://esastar-publication-ext.sso.esa.int/ESATenderActions/filter/open

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