Tender Notice |
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| TenderID | 107871867 |
| Tender Brief | Tenders Are Invited For Shandong Youyan Integrated Circuit 8-Inch Silicon Wafer Expansion Project Phase Iii Diamond Wire Cutting Machine Procurement(2) |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | China |
| Tender Value | Plz Refer Document |
| Tender Value In USD | Plz Refer Document |
Key Dates |
|
| Publish Date | 22 Jan 2026 |
| Last Date of Bid Submission | 28 Feb 2026 |
CPVs |
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| 44310000-Wire products | |
Other Detail |
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| View Original Tender Notice / Tender Document |
