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Bids Are invited for 3D Software , Curing Machine Unit , Soldering Station Unit Variable Temp Yihua , Hot Ai ... in India

Tender Notice

TenderID 107225745
Tender Brief Bids Are invited for 3D Software , Curing Machine Unit , Soldering Station Unit Variable Temp Yihua , Hot Air Blower For Per-Heating , Spot Welding Machine , Antistatic Gloves , Industrial Gloves , Multimeter , Soldering Wire , Silicon Wire , Heat Sh
Competition Type ICB/NCB (Plz Refer Document)
Funded By Self-Funded
Country India
Tender Value Plz Refer Document
Tender Value In USD Plz Refer Document

Key Dates

Publish Date 09 Jan 2026
Last Date of Bid Submission 30 Jan 2026

CPVs

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