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Contract Award For Shanghai Jiao Tong University Automated Wafer Thickness And Surface Top...


Contract Award Notice

TRR 24285479
Organization shanghai jiaotong university
Tender No 1069-254Z20250285
Funded By Self-Funded
Country China , Eastern Asia
Contract Value Plz Refer Document

Work Detail

Contract Award For Shanghai Jiao Tong University Automated Wafer Thickness and Surface Topography Measurement System Procurement Project

Key Dates

Contract Date 10 Apr 2025

Contact Information

Company Name MICRONANO (Hong Kong) Technlogy Co. Ltd
Contract Value Plz Refer Document
Contract Date 10 Apr 2025

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