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Contract Award For Nantong Kangyuan IC Packing Board Project (Phase I)-X-Ray Coating Thick...


Contract Award Notice

TRR 22443084
Organization Nantong Hong Yuen Circuit Technology Co., Ltd.
Tender No 0730-244012SZ0076/01
Funded By Self-Funded
Country China , Eastern Asia
Contract Value Plz Refer Document

Work Detail

Contract Award For Nantong Kangyuan IC Packing Board Project (Phase I)-X-ray coating thickness gauge 1 set (Rebid)

Key Dates

Contract Date 30 Dec 2024

Contact Information

Company Name Guangdong Zhengye Technology COLTD.
Contract Value Plz Refer Document
Contract Date 30 Dec 2024

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