Subscribe     Pay Now

Contract Award For Procurement Of Taiko Backside Grinder And Ring Cutting Equipment For 12...


Contract Award Notice

TRR 17772503
Organization Beijing Yan Dong Microelectronic Technology Co., Ltd.
Tender No 0610-2440IH010123
Funded By Self-Funded
Country China , Eastern Asia
Contract Value Plz Refer Document

Work Detail

Contract Award For Procurement of Taiko Backside Grinder and Ring Cutting Equipment for 12-inch Semiconductor IC Wafer of YDMT

Key Dates

Contract Date 25 Mar 2024

Contact Information

Company Name DISCO HITEC (CHINA) CO. LTD.
Contract Value Plz Refer Document
Contract Date 25 Mar 2024

View Notice Now...

Login with your Social Account for Instant Access to this notice


Tell us about your Product / Services,
We will Find Tenders for you