Tenders Are Invited For Consultative Engineering And Construction Services – Management Of The Component Lib ... in Germany

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Consultative Engineering And Construction Services – Management Of The Component Library, Provision Of Layout Services, Production Of Printed Circuit Boards. 1. Management Of The Component Library • Management Of The Component Library (Cadence Allegro Hdl) With Connection To An Sql Database (Iis Component Database) • Creation Of Required Footprints And Circuit Diagram Symbols • Conversion Of Existing Components From Mentor Boardstation 2005 (This Requires A Mentor Boardstation License And Installation Required By The Provider!) • Creation Of The Associated Database Entries • Testing Of The New Components (Packaging, Test Layout, Etc.) • Release Of The New Components • Maintenance Of The Existing Database (Incorporation Of Manufacturer Updates, Etc.) • Provision Of The Library In The Fraunhofer Iis It Infrastructure • Short Response Times Must Be Guaranteed (2 Working Days For Standard Components) • Guarantee Of Data Archiving (Min. 5 Years) 2. Layout Services • Unbundling Of Circuit Boards Based On Cadence Allegro As Well As Mentor Boardstation In Close Coordination With Fraunhofer Iis Developers • For Complex Circuits And Other Extreme Requirements (Size, Etc.) The Unbundling Of The Circuit Boards Takes Place Together With Iis Developers, If Necessary Also At The Institute (Locations Erlangen/Tennenlohe And Nuremberg) • Quick Processing (Within 2 Working Days Of Change Requests For Redesigns Of Completed Projects • Experience In High-Frequency Design • Experience In High-Speed Design (Matching Of Cable Lengths, Signal Integrity, Emc Etc.) • Ensuring Data Archiving (Min. 5 Years) • Optional: Circuit Diagram Input In Collaboration With The Developers At Fraunhofer Iis 3. Production Of Assemblies • Production Of Circuit Boards (Also By External Service Providers) According To The Specifications Of Fraunhofer Iis (Experience With Hf Layer Structure And Hf Substrate Material From Rogers And Panasonic - Megtron4 And 6 As Well As Standard Materials Such As Fr4) • Design Advice From The Contractor • Production Or Procurement Of The Required Screen Printing Stencils For The Corresponding Device • Procurement Of The Required Components Based On Generated Boms (Bill Of Material) • Assembly Of The Circuit Boards, For Special Requirements According To Fraunhofer Iis Specifications With Suitable External Assemblers. • Optical And Electrical Inspection And Testing Of The Assembled Assembly • X-Ray Inspection (If Necessary By Third-Party Service Providers) • Production Or Procurement Of Unequipped Circuit Boards According To Fraunhofer Iis Specifications (Layer Structure, Substrate, Impedance Control, Delivery Time, Quick Service 5 Working Days, Etc.) • Short-Term Repairs And Replacements Of Existing Assemblies (Within 2 Working Days) • Storage Of Frequently Required Components • The Assemblies Must Always Be Manufactured In Accordance With Rohs Special Requirements, But Exceptions Must Also Be Possible (E.G. For Space Travel Or Other Special Applications) • Assembly Must Be Possible In Smd And Tht Technology • Components Must Be Assembled By Hand Upon Request • Guarantee Of Data Archiving (Min. 5 Years) Further Information

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